YCS Solder Paste 138 150 183 199 215℃ PCB BGA CPU Tin Planting Flux

YCS 50g Solder Paste 138℃ 150℃ 183℃ 199℃ 215℃ paste flux for Mobile Phone PCB BGA CPU welding repairs. YCS high-quality high temperature, medium temperature and low temperature solder paste achieves a perfect balance between fluidity and stability, ensuring precise solder ball placement and soldering.